• 搭载NVIDIA Jetson AGX Orin™ 32GB/64GB计算核心
• 最高可达275 TOPS的AI算力
• 宽输入电压设计:9至36VDC
• 具有一组B-Key、一组E-Key、一组M-Key插槽
• 具有一组GbE及一组10GbE区域网络连接端口
• 运行温度:-25°C至+80°C
•八倍AI算力实现低延迟AI推论 |
NVIDIA Jetson AGX Orin计算核心提供最高275 TOPS算力,是NVIDIA® Jetson AGX Xavier™ 32GB计算模块的八倍以上。此平台内建2048 NVIDIA® CUDA® cores及64 Tensor Cores,能在边缘端实现服务器等级、低延迟的AI推论。 |
•完善的M.2扩展及一组10GbE区域网络连接端口 |
AIB-MX13/23作为具有扩展性的平台,内建一组支持LTE/5G的M.2 B-Key、一组支持储存硬件扩展的M.2 M-Key、一组支持Wifi/蓝牙/GPS的M.2 E-Key。在网络方面,该平台搭载一组10GbE连接埠,提供了最高100亿位元/秒的高速数据传输功能,比传统GbE标准高了10倍。 |
•宽输入电压及宽运行温度设计,适用多种嵌入式应用 |
为了能适用于多种嵌入式应用,特别是如智能工厂、智能城市、智能交通等涉及严苛环境的场域,AIB-MX13/23能够在-25°C至+80°C内正常运行,并支持9至36VDC的宽输入电压。 |
Model Number | AIB-MX13 | AIB-MX23 |
Module Compatibility | NVIDIA Jetson AGX ORIN 32GB | NVIDIA Jetson AGX ORIN 64GB |
AI Performance | 200 TOPS | 275 TOPS |
GPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores | 2048-core NVIDIA Ampere GPU with 64 Tensor Cores |
CPU | 8-core Arm® Cortex®-A78AE v 8.2 64-bit CPU 2MB L2 + 4MB L3 | 12-core Arm® Cortex®-A78AE v 8.2 64-bit CPU 3MB L2 + 6MB L3 |
Memory | 32 GB 256-bit LPDDR5 204.8 GB/s | 64GB 256-bit LPDDR5 204.8 GB/s |
Storage | 64GB eMMC 5.1 | |
Display | 1 x HDMI 2.0 Type A | |
TPM | TPM v2.0 (optional) | |
RTC | With super capacitor, battery (optional) | |
Audio | Line-out/Line-in/Mic (optional with daughter board) | |
Camera Input | 1x 16-Lane MIPI Expansion Connector | |
LAN | 1 x RJ-45 GbE port, 1 x RJ-45 10GbE port | |
USB | 2 x USB 3.2 Gen1 Type A, 1 x OTG Type-C, 1 x USB 3.2 Gen2 Type-C | |
I/O Interfaces | 2 x I2C, 1 x I2S, 1 x SPI, 5 x GPIO, 1 x 3.3VDC/0.5A, 2 x 5VDC/0.5A, 1 x 12VDC/0.5A, 1 x USB 2.0, 2 x UART, 1 x UART (Debug only), 1 x RS-232, 1 x RS-422/485 (2-in-1), 2 x CAN 2.0b (Isolation; support CAN FD) |
|
Expansion | 1 x M.2 B-Key 3042/3052 (LTE/4G/5G) 1 x M.2 E-Key 2230 (WiFi/BT) 1 x M.2 M-Key 2280 (supports NVMe; PCIe x4 Gen4) 1 x microSD Card Slot |
|
MISC. Function | 1 x Power / 1 x Recov ery / 1 x Reset button | |
Power Consumption | Idle: 6.655 W Full Loading: 52.25* W |
Idle: 6.9 W Full Loading: 72.25* W |
*For more test condition information, please refer to user manual | ||
Power Input/Connector | DC-in 9 to 36 VDC / 4-pin DC Jack Power Connector | |
Dimension (WxDxH) | 131 x 120 x 62.9 mm (5.16 x 4.72 x 2.47 in) | |
Net Weight | 0.701 kg (1.54 lb) w/ Fansink | |
Vibration | 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis | |
Shock | 10 G, IEC 60068-2-27, half sine, 11 ms duration | |
Temperature | Operating Temp.: -25°C ~ +80°C (-13°F ~ +176°F) Storage Temp.: -40°C ~ +85°C (-40°F ~ +185°F) |
|
Humidity | 95% @ 40°C (104°F) (non-condensing) | |
Software Support | Linux (Support Jetpack 5.0 above) | |
Certification | CE / FCC Class A / UKCA |
Model Number | Description |
---|---|
AIB-MX13-1-A1 |
AGX Orin 32GB, 1 x HDMI, 1 x GbE, 1 x 10GbE, 3 x USB, B/E/M Key, 9 to 36 VDC input, -25°C~80°C |
AIB-MX23-1-A1 |
AGX Orin 64GB, 1 x HDMI, 1 x GbE, 1 x 10GbE, 3 x USB, B/E/M Key, 9 to 36 VDC input, -25°C~80°C |
Model Name | 档名 | 操作系统 | 版本 | 更新时间 | 下载 |
---|---|---|---|---|---|
AIB-MX13/23 | Aetina_Success-Story_Trueflaw | v1.0 | 2024-05-22 | View | |
Jetson Series | Aetina_Jetson Series_brochure | v2.0 | 2024-05-21 | View | |
Jetson Orin Series | Aetina_Peripherals List for Jetson Orin Series | v1.5 | 2024-02-19 | View | |
AIB-MX13/23 | Aetina_AIB-AIB-MX13/23_user manual | v1.3 | 2023-11-02 | View | |
AIB-MX13/23 | Aetina_AIB-MX13/23_datasheet | v1.2 | 2024-01-11 | View |
Model Name | 档名 | 操作系统 | 版本 | 更新时间 | 下载 |
---|---|---|---|---|---|
AIB-MX13/AIB-MX23 AIE-KX13/AIE-KX23 AIE-PX13/AIE-PX23 |
PATCH_R36_3_0_ORIN_AGX_AIB-MX03_v1.2.0_Standard | JetPack 6.0 | 2024-09-12 | View | |
AIB-MX13/AIB-MX23 AIE-KX13/AIE-KX23 |
R35_3_1_ORIN_AGX_AIB-MX03_v8_STD | L4T R35.3.1-JetPack 5.1.1 | 2023-08-16 | View |