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Supports NVIDIA Jetson AGX Orin™ 32GB/64GB module

Up to 275 TOPS of AI performance

Wide input voltage range from 9 to 36VDC

1 x M.2 B-Key/1 x E-Key/1 x M-Key slot

1 x GbE/1 x 10GbE LAN port

Operating Temperature: -25°C ~ +80°C


NVIDIA Preferred Partner      


● 8 x AI performance enables AI inference with low latency
NVIDIA Jetson AGX Orin module offers up to 275 TOPS, 8 times more than NVIDIA Jetson AGX Xavier™ 32GB module. Built in 2048 NVIDIA CUDA® cores and 64 Tensor Cores, NVIDIA Jetson AGX Orin module enables server-class AI inference at the edge with low latency. 
● Comprehensive M.2 expansion and 1x10GbE LAN port
AIB-MX13/23 is a platform with high expansion ability, built in 1x M.2 B-Key for LTE/5G, 1x M.2 M-Key for storage, and 1x M.2 E-Key for Wifi/Bluetooth/GPS. For network, on-board 1x10GbE port offers data speeds up to 10 billion bits per second, 10 times faster than traditional GbE standard. 
● Wide input power and operating temperature for various embedded applications 

To meet various embedded applications, especially challenging environments in smart factory, smart city, and smart transportation, AIB-MX13/23 supports temperature ranging from -25°C to 80°C and wide input power from 9 to 36VDC.


Model Number AIB-MX13 AIB-MX23
Module Compatibility NVIDIA Jetson AGX ORIN 32GB NVIDIA Jetson AGX ORIN 64GB
AI Performance 200 TOPS 275 TOPS
GPU 1792-core NVIDIA Ampere GPU with 56 Tensor Cores 2048-core NVIDIA Ampere GPU with 64 Tensor Cores
CPU 8-core Arm® Cortex®-A78AE v 8.2 64-bit CPU 2MB L2 + 4MB L3 12-core Arm® Cortex®-A78AE v 8.2 64-bit CPU 3MB L2 + 6MB L3
Memory 32 GB 256-bit LPDDR5 204.8 GB/s 64GB 256-bit LPDDR5 204.8 GB/s
Storage 64GB eMMC 5.1
Display 1 x HDMI 2.0 Type A
TPM TPM v2.0 (optional)
RTC With super capacitor, battery (optional)
Audio Line-out/Line-in/Mic (optional with daughter board)
Camera Input 1x 16-Lane MIPI Expansion Connector
LAN 1 x RJ-45 GbE port, 1 x RJ-45 10GbE port
USB 2 x USB 3.2 Gen1 Type A, 1 x OTG Type-C, 1 x USB 3.2 Gen2 Type-C
I/O Interfaces 2 x I2C,
1 x I2S,
1 x SPI,
5 x GPIO,
1 x 3.3VDC/0.5A,
2 x 5VDC/0.5A,
1 x 12VDC/0.5A,
1 x USB 2.0,
2 x UART,
1 x UART (Debug only),
1 x RS-232,
1 x RS-422/485 (2-in-1),
2 x CAN 2.0b (isolation; support CAN FD)
Expansion 1 x M.2 B-Key 3042/3052 (LTE/4G/5G)
1 x M.2 E-Key 2230 (WiFi/BT)
1 x M.2 M-Key 2280 (supports NVMe; PCIe x4 Gen4)
1 x microSD Card Slot
MISC. Function 1 x Power / 1 x Recov ery / 1 x Reset button
Power Consumption Idle: 6.655 W
Full Loading: 52.25* W
Idle: 6.9 W
Full Loading: 72.25* W
  *For more test condition information, please refer to user manual
Power Input/Connector DC-in 9 to 36 VDC / 4-pin DC Jack Power Connector
Dimension (WxDxH) 131 x 120 x 62.9 mm (5.16 x 4.72 x 2.47 in)
Net Weight 0.701 kg (1.54 lb) w/ Fansink
Vibration 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis
Shock 10 G, IEC 60068-2-27, half sine, 11 ms duration
Temperature Operating Temp.: -25°C ~ +80°C (-13°F ~ +176°F)
Storage Temp.: -40°C ~ +85°C (-40°F ~ +185°F)
Humidity 95% @ 40°C (104°F) (non-condensing)
Software Support Linux (Support Jetpack 5.0 above)
Certification CE / FCC Class A / UKCA


Ordering Information

Model Number Description


AGX Orin 32GB, 1 x HDMI, 1 x GbE, 1 x 10GbE, 3 x USB, B/E/M Key, 9 to 36 VDC input, -25°C~80°C


AGX Orin 64GB, 1 x HDMI, 1 x GbE, 1 x 10GbE, 3 x USB, B/E/M Key, 9 to 36 VDC input, -25°C~80°C


Model Name File Name OS Version Update Date Download
AIB-MX13/23 Aetina_Success Story_Trueflaw v1.0 2024-05-22 View
Jetson Series Aetina_Jetson Series_brochure v2.0 2024-05-21 View
Jetson Orin Series Aetina_Peripherals List for Jetson Orin Series v1.5 2024-02-19 View
AIB-MX13/23 Aetina_AIB-MX13/23_datasheet v1.2 2024-01-11 View
AIB-MX13/23 Aetina_AIB-MX13/23_user manual v1.3 2023-11-02 View
Model Name File Name OS Version Update Date Download
R35_3_1_ORIN_AGX_AIB-MX03_v8_STD L4T R35.3.1-JetPack 5.1.1 2023-08-16 View
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