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AIB-MX11/12/21/22

• 搭載NVIDIA® Jetson AGX Orin™ 32GB/64GB運算核心

• 最高可達275 TOPS的AI算力

• 寬輸入電壓設計：9至36VDC

• 具有一組B-Key、一組E-Key、一組M-Key插槽

• 具有一組GbE、一組10GbE、2/4組IEEE 802.3af GbE PSE連接埠

• 支援Innodisk頻外遠端管理模組

• 作業溫度：-25°C至+80°C

NVIDIA Preferred Partner      

產品介紹

•八倍AI算力實現低延遲AI推論
NVIDIA Jetson AGX Orin運算核心提供最高275 TOPS算力，是NVIDIA® Jetson AGX Xavier™ 32GB運算模組的八倍以上。此平台內建最高可到2048 NVIDIA® CUDA® cores及64 Tensor Cores，能在邊緣端實現伺服器等級、低延遲的AI推論。 
•完善的M.2擴充及區域網路連接埠
AIB-MX11/12/21/22作為具有高擴充性的平台，內建一組支援LTE/5G的M.2 B-Key、一組支援Wifi/藍牙的M.2 E-Key、一組支援儲存硬體擴充的M.2 M-Key。在網路方面，該平台搭載的2或4組的PSE連接埠能夠支援2或4組POE cameras，加上一組10GbE連接埠，提供了最高100億位元/秒的高速數據傳輸功能，比傳統GbE標準高了10倍。 
•寬輸入電壓及寬作業溫度設計，適用多種嵌入式應用

為了能適用於多種嵌入式應用，特別是如智慧工廠、智慧城市、智慧交通等涉及嚴苛環境的場域，AIB-MX11/12/21/22能夠在-25°C至+80°C內正常運行，並支援9至36VDC的寬輸入電壓。

*AIB-MX11/12/21/22 目前是初步的產品，其規格可能在無提前通知下有所變動及調整。

產品規格

Model Number AIB-MX11 AIB-MX12 AIB-MX21 AIB-MX22
Module Compatibility NVIDIA Jetson AGX Orin 32GB NVIDIA Jetson AGX Orin 64GB
AI Performance 200 TOPS 275 TOPS
GPU 1792-core NVIDIA Ampere GPU with 56 Tensor Cores 2048-core NVIDIA Ampere GPU with 64 Tensor Cores
CPU 8-core Arm® Cortex® -A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 12-core Arm® Cortex® -A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
Memory 32GB 256-bit LPDDR5 204.8 GB/s 64GB 256-bit LPDDR5 204.8 GB/s
Storage 64GB eMMC 5.1
Display 1 x HDMI 2.0 Type A
TPM TPM v2.0 (optional)
RTC With super capacitor, battery (optional)
Audio Line-out/Line-in/Mic (optional with daughter board)
Camera Input 1 x 16-Lane MIPI Expansion Connector (120-Pin)
LAN 1 x RJ-45 GbE port, 1 x RJ-45 10GbE port
PoE Interface 2 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*		 4 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*		 2 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*		 4 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*
  *PSE Port 1 & Port 2 support IEEE 802.3at compliant; Total PSE ports support up to 60W
USB 2 x USB 3.2 Gen1 Type A, 1 x OTG Type-C, 1 x USB 3.2 Gen2 Type-C
I/O Interfaces 2 x UART,
1 x UART (Debug only),
1 x RS-232,
1 x RS-422/485 (2-in1),
2 x CAN 2.0b (isolation; support CAN FD),
2 x I2C,
1 x I2S,
1 x SPI,
5 x GPIO,
2 x 3.3VDC/0.5A,
3 x 5VDC/0.5A,
1 x 12VDC/0.5A,
1 x USB 2.0,
1 x microSIM Card Slot
Expansion 1 x M.2 B-Key 3042/3052 (LTE/4G/5G)
1 x M.2 E-Key 2230 (WiFi/BT)
1 x M.2 M-Key 2280 (supports NVMe; PCIe x2 Gen3), 1 x microSD Card Slot
MISC. Function 1 x Power / Recovery / Reset button
Power Consumption Idle: 10.5 W
Full Loading: 111* W		 Idle: 12 W
Full Loading: 132* W
  *For more test condition information, please refer to user manual
Power Input/Connector DC-in 9 to 36 VDC / 4-Pin DC Jack Power Connector
Dimension (WxDxH) 176 x 132 x 57.32 mm (6.93 x 5.19 x 2.26 in)
Net Weight 0.980 kg (2.161 lb) w/ Fansink
Vibration 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis
Shock 10 G, IEC 60068-2-27, half sine, 11 ms duration
Temperature Operating Temp.: -25°C ~ +80°C (-13°F ~ +176°F)
Storage Temp.: -40°C ~ +85°C (-40°F ~ +185°F)
Humidity 95% @ 40°C (104°F) (non-condensing)
Software Support Linux (Support Jetpack 5.0 above)
Certification CE / FCC Class A / UKCA

產品規格

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機構尺寸

AIB-MX21 dimension 

訂購訊息

Model Number Description

AIB-MX11-1-A1

AGX ORIN 32GB + carrier board + FAN + power adaptor + US power cord with 2 PSE ports, -25°C to + 80°C

AIB-MX12-1-A1

AGX ORIN 32GB + carrier board + FAN + power adaptor + US power cord with 4 PSE ports, -25°C to +80°C

AIB-MX21-1-A1

AGX ORIN 64GB + carrier board + FAN + power adaptor + US power cord with 2 PSE ports, -25°C to +80°C

AIB-MX22-1-A1

AGX ORIN 64GB + carrier board + FAN + power adaptor + US power cord with 4 PSE ports , -25°C to +80°C

相關下載

Document
Model Name 檔名 作業系統 版本 更新時間 下載
Jetson Orin Series Aetina_Peripherals List for Jetson Orin Series v1.5 2024-02-19 View
AIB-MX11/12/21/22 Aetina_AIB-MX11/12/21/22_user manual v1.1 2023-11-02 View
AIB-MX11/12/21/22 Aetina_AIB-MX11/12/21/22_datasheet v1.0 2024-01-11 View
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